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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1 / 14 tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 tsz22111 ? 14 ? 001 www.rohm.com voltage detector ic series cmos over voltage detector ic bd 71l4l - 1 series general description s rohms bd 71 l 4l - 1 series is highly accurate and low current over voltage detector ic . it is an n - c h annel open - drain o utput typ e with detection voltage of 4.05 v and hysteresis voltage of 30mv. it is most suitable for monitoring the charg e of a lithium - ion battery. features ? high accuracy d etection v oltage ? l ow current c onsumption ? n - c h annel open d rain o ut put ? wide operating t emperature r ange ? very s mall and low h eight p ackage ? package ssop5 is similar to sot - 23 - 5 (jedec) typical application circuit key specifications ? detection v oltage : 4.0 5 v ( typ.) ? high a ccuracy detection v oltage : 0.8 % ? ultra - l ow c urrent c onsumption : 0. 8 a ( typ.) ? op erating temperature r ange: - 40c to + 8 5c package w(typ) x d(typ) x h(max) ? ssop5: 2.90mm x 2.80mm x 1. 2 5mm ? h vsof5 : 1 . 6 0mm x 1 . 6 0mm x 0 . 60 mm applications ? all electronics equipment with lithium - ion battery ? all electronics equipment that needs over - voltage protection v dd1 bd 71l4l - 1 v dd2 gnd c l ( capacitor for noise filterin g) r l c in microcontroller rst datashee t
2 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 connection diagram ssop5 h vsof5 pin descriptions ssop5 h vsof5 pin no. symbol function pin no. symbol function 1 ou t output pin 1 out output pin 2 vd d power supply voltage 2 sub * substrate 3 gn d gnd 3 vdd * power supply voltage 4 n.c. no connection pin 4 vdd * power supply voltage 5 n.c. no connection pin 5 gnd gnd * the sub pin ( pin no. 2 ) and vdd pins ( pin no. 3 and 4 ) must be wired together. ordering information lot. no top view out vdd gnd n.c. n.c. marking top view out sub vdd gnd vd d 4 3 2 1 5 marking lot. no n.c. pin is electrically open and can be connected to either vdd or gnd. a r l 1 part function output logic detection voltage value package packaging and number 71 : over voltage l : active 4l : 4.05v g : ssop5 forming specification detector low hfv : hvsof5 embossed tape and reel tr : the pin number 1 is the upper right : ssop5 : hvsof5 r t x x x x - 1 b d x x
3 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings parameter symbol limits unit power supply voltage v dd - gnd - 0.3 to +7 v output voltage n - c h annel open drain output v out gnd - 0.3 to +7 v output current i o 70 ma power dissipation ssop5 *1* 3 pd 0. 54 w hv so f 5 * 2 * 3 0.53 operating temperature topr - 40 to +8 5 c ambient storage temperature tstg - 55 to +125 c *1 reduced by 0.00 54 w/ c when used over 25 c. * 2 reduced by 0.00 53 w/ c when used over 25 c. * 3 when mounted on rohm standard circuit board (70mm70mm1.6mm, glass epoxy board). caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circ uit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. electrical characteristics ( unless otherwise specified , ta= 0 c to 60 c , v dd = 1.2 v to 6.0v ) parameter symbol condition s limit unit min typ max detection voltage v det r l = 470k v dd =lh ta=25 c 4.0 3 4 4.0 5 4.0 6 6 v ta =0 c to 60 c 4.018 - 4.0 8 3 hysteresis voltage v det v dd =lhl, r l = 470k - 30 40 mv output delay time lh t plh r l =100k , c l =100pf * 4 v out gnd50% - - 100 s output delay time hl t phl r l =100 k , c l =100pf * 5 v out v dd 50% - - 100 s supply current 1 i dd 1 v dd = v det + 0.2v - 0. 6 0 2. 4 0 a supply current 2 i dd 2 v dd = v det - 0.2v - 0. 7 0 2. 8 0 a operating voltage range v opl v o ut R 0.8v, r l =470k 1.20 - - v low output voltage(nch) v ol v dd = v det +0.2 v, i sink =4.0 ma - - 0.3 v output leak current i leak v dd = v ds =3.8 v - - 1.0 ua v det standard detection voltage 4 .0 5 v r l pull - up resistor between v out and v dd . c l capacitor to be connected between v out and gnd. design guarantee. (outgoing inspection is not done on all products.) * 4 t plh v dd v det typ . + 0.5v to v det typ. - 0.5v * 5 t phl v dd v det typ - 0.5v to v det typ. + 0.5v block diagram figure 1 . bd 7 1 l4l - 1 vout gnd vdd vref
4 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 0 10 20 30 40 50 60 70 80 90 100 110 0 5 10 15 20 low output voltage : v ol [mv] isink[ma] 0.0 0.2 0.4 0.6 0.8 1.0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 operating voltage range :v opl [v] supply voltage:v dd [v] 0.0 1.0 2.0 3.0 4.0 5.0 0 1 2 3 4 5 6 7 detection voltage : v det [v] supply voltage : v dd [v] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 1 2 3 4 5 6 7 circuit current : i dd [ a] supply voltage : v dd [v] typical performance curves bd 71l4lg - 1 figure 2. detection voltage bd 71l4l - 1 figure 3. circuit current bd 71l4l - 1 figure 4. low output voltage v dd =4.0v bd 71l4l - 1 figure 5. o perating v oltage r ange ta= 25 c t a= 0c ta= 60 c ta= 25 c t a= 0c ta= 60 c bd 71l4l - 1 ta= 25 c t a=0 c ta= 60 c ta= 25 c t a= 0c ta= 60 c
5 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 10 20 30 40 50 60 circuit current when off : i dd [ a] temperature : ta[ c] 3.80 3.85 3.90 3.95 4.00 4.05 4.10 4.15 4.20 0 10 20 30 40 50 60 detection voltage : v det [v] temperature : ta[ c] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 10 20 30 40 50 60 operating voltage range : v opl [v] temperature : ta[ c] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 10 20 30 40 50 60 circuit current when on : i dd [ a] temperature : ta[ c] typical performance curves C continued 3.0 bd 71l4l - 1 bd 71l4l - 1 f igure 8. supply current when off vs. temperature v dd =v det - 0.2v v dd = 3.85v high to low (vdet) low to high (vdet - vdet) bd 71l4l - 1 figure 6. detection voltage vs. temperature bd 71l4l - 1 figure 7. operating voltage range vs. temperature figure 9. supply current when on vs. temperature v dd =v det +0.2v v dd =4.25v
6 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 0 10 20 30 40 50 60 70 80 90 100 0.8 1.2 1.6 2 2.4 2.8 pulse wiidth high : wd[ s] v dd - low : v dd [v] 12 16 20 24 28 32 36 40 0 10 20 30 40 50 60 output delay time : t phl [ s] temperature : ta[ c] 10 11 12 13 14 15 16 17 18 19 20 0 10 20 30 40 50 60 output delay time : t plh [ s] temperature : ta[ c] 0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 pulse width high : wd[ s] temperature : ta[ c] typical performance curves C continued bd 71l4l - 1 bd 71l4l - 1 bd 71l4l - 1 figure 10. output delay time (t phl ) v dd =v det - 0.5v to v det +0.5v v dd =3.55v to 4.55v figure 11. output delay time(t plh ) v dd =v det +0.5v to v det - 0.5v v dd =4.55v to 3.55v figure 12. pulse width vs. temperature v dd - low =1.2v, v dd - high =4.2v, c in =0.1uf output will not change when pulse width is lower or equal to these results. puls e width above the results will cause the output to change. bd 71l4l - 1 figure 13. pulse width vs. voltage level v dd - high =4.2v, c in =0.1uf, ta=25c output will not change when pulse width is lower or equal to these results. pulse width above the results will cause the output to change.
7 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 application information 1. explanation of operation t he detection and release voltages are used as threshold voltag es. when the voltage applied to v dd pin reaches the appropriate threshold voltage, out pin voltage switches from either high to low or from low to high. please refer to the timing waveform and electrical characteristics for information on hysteresis. because the bd 71l4l - 1 uses an open drain output type, it is necessary to connect a pull - up resistor to v dd or another power supply if needed [the output high voltage (v out ) in this case becomes v dd or the voltage of the other power supply]. figure 1 4 . internal block diagram 2. timing waveform example: the following shows the relationship between the input voltage ( v dd ) and the output voltage ( v out ) when the input power supply voltage ( v dd ) swept up and down (the circuit is shown in figure 1 4 ). when the power supply is turned on, the output is unstable from after over the operating limit voltage ( v opl ) until t plh . therefore it is possible that the reset signal is not outputted when the rise time of v dd is faster than t plh . when v dd is greater than v opl but less than the reset detection voltage (v det ), the output voltage will switch to high . if v dd exceeds the reset detection voltage (v det ) when the power supply is powered up , v out switches from h to l (with a delay of t phl ) . if v dd drops below the release voltage ( v det - ? v det ) when the power supply is powered down, v out switches to h (with a delay of t plh ). the potential difference between the detection voltage and the release voltage is known as the hysteresis width (? v det ). figure 15 . timing waveform vref r 1 r 2 vdd gnd q 1 vout r 3 r l 1 v dd v det v opl 0v v out t phl t phl t plh v ol v oh v det - v det t plh 5 4 3 2
8 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 3. circuit applications ( 1) ex ample of common power supply detection reset circuit . case1: p ower supply of the microcontroller (v dd2 ) differs from the power supply of the reset detection ic (v dd1 ). attach a load resistance r l between output of reset detection ic and v dd2 as shown in figure 16. case2: p ower supply of the microcontroller (v dd1 ) is same as the power supply of the reset detection ic (v dd1 ). connect a pull up resistor between output and v dd1 . this ic s hysteresis between detection voltage and release voltage is 30mv(typ), so when the v out logic changes , chattering o ccur s . c in value needs more than 0.1 u f to eliminate this. when a capacitance c l for noise filtering is connected to the out pin (the reset signal input terminal of the microcontroller), please take into account the rise and fal l waveform of the output voltage (v out ). ( 2) the following is an example of a circuit application in which an or connection between two types of detection voltage resets the microcontroller. to reset the microcontroller when many independent power supplies are used in the s ystem, or connect the device to microcontrollers input with pull - up resistor to the supply voltage of the microcontroller (v dd3 ) as shown in figure 1 7 . by pulling - up to v dd3 , output high voltage of micro - controller power supply is possible. v dd1 bd 71l4l - 1 v dd2 gnd c l ( capacitor is for noise filtering r l c in microcontroller rst figure 16 . open drain output type figure 1 7. or circuit connection application v dd2 v dd1 v dd3 gnd microcontroller r l bd 71l4l - 1 bd71l4l - 1 r st
9 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 circuit applications (continued) (3) example of power supply with resistor dividers in applications wherein the power supply voltage of an ic comes from a resistor divider circuit, an in rush current will flow into the circuit when the output level switches from h igh to low or vice versa. in rus h current is a sudden surge of current that flows from the power supply (v dd ) to ground (gnd) as the output logic changes its state. this current flow may cause malfunction in the systems operation such as output oscillations, etc. figure 1 8 . resistor divider connection application input voltage will decrease by a drop of [inrush current (i 1 )] [input resistor (r 2 )] because of the inrush current at the time when the output switches from high to low. when the input voltage decreases and falls below the release voltage [ v det - v det ], the output voltage switches from low to high. at this time, the inrush current stops flowing through output hig h, and the voltage drop is reduced. as a result, the output switches from high to low, which again causes the inrush current to flow and the voltage to drop. this operation repeats and will result to oscillation. in case resistor divider will not us e and only r 2 will use, same response will happen. note1: the circuit connection mentioned above does not guarantee successful operation. please perform thorough evaluation using the actual application and set countermeasures. i dd v dd v det 0 inrush current figure 1 9 . current consumption vs. power supply voltage v out r 2 v dd bd71l4l - 1 gnd r 1 i 1 v 1 c in c l c in 0.1f (note1)
10 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins . 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground volt age ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of ext ernal components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature rating be exceeded the rise in te mperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction t emperature rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inr ush current when power is first supp lied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground. inter - pin shorts could be du e to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos t ransistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line.
11 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 12. regarding input pins of the ic in the construction of this ic, p - n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, con ditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. ev en if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electr ical characteristics of this ic . 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and the maximum junction temperature rating are all within the area of safe operation (aso). 15. bypass capacitor for noise rejection to help reject noise, put more than 0. 1 f capacitor between v dd pin and gnd and 1000pf capacitor between v out pin and gnd. be careful when using extremely big capacitor as transient response will be affected. 16. the v dd line impedance might cause oscillation because of the detection current. 17. a v dd to gnd capacitor (as close connection as possible) should be used in high v dd line impedance condition. 18. external parameters the recommended parameter range for r l is 1 0k to 1m. there are many factors (board layout, etc) that can affect characteristics. operating beyond the recommended values does not guarantee correct operation. please verify and confirm using practical appli cations. 19. when v dd falls below the minimum operating voltage, output becomes unstable . when output is connected to pull - up voltage, output will be equivalent to pull - up voltage. 20. power - on r eset o peration please note that the power on reset output varies with the v dd rise time. please verify the behavior in the actual operation. 21. this ic has extremely high impedance pins. small leak current due to the uncleanness of pcb surface might cause unexpected operations. application values in these conditions should be selected carefully. if the leakage is assumed between the vout pin and the gnd pin, consider to set the value of pull up resistor lower than 1/10 of the impedance of assumed leakage route.
12 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 physical dimension , tape and reel information package na me ssop5
13 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 package name h vsof5
14 / 14 bd 71l4l - 1 series tsz02201 - 0r7r0g300030 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. 08.jun.2016.rev.005 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 20 .may.2013 001 new release 2 4 . july .2013 002 modify the general description and applications on page 1 change d vdet spec on pages 1 ~ 3 change d idd1 and idd2 spec on page 3 change d i leak condition on page 3 2 4 .oct.2013 003 add 1 packages as following: h vsof5 31 .jan.2014 004 modify the package on page 1 and the connection diagram on page 2 add note of hvsof5 on page 2 08 .jun.2016 005 add package dimension on page 1 add note for ssop5 nc pin on page 2 updated application information on page 7 ~ 9 updated operational notes on page 10 ~ 11
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
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datasheet part number bd71l4lg-1 package ssop5 unit quantity 3000 minimum package quantity 3000 packing type taping constitution materials list inquiry rohs yes bd71l4lg-1 - web page distribution inventory

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